There have been questions raised recently about the TDP of the upcoming Snapdragon 810 chipset, which was apparently high enough to cause Samsung to allegedly drop it out of its upcoming Galaxy S6 smartphone. On the other hand, LG dismissed it as a non-issue.
To put the confusion to rest, STJS Gadgets Portal ran some tests on both the new Snapdragon 810 and the Snapdragon 801 to see how the new chipset compares to what we are already familiar with by now.
The tests compared the skin temperatures, that is the temperature of the surface of the device (which is what matters since that’s the part you will be touching) in a 25 degree Celsius room temperature environment. Two tests were ran on the devices, one with Asphalt 8 being played to check gaming performance, and the other where 4K video was recorded on the devices.
In the first test, the device running Snapdragon 810 managed to reach around 40°C while the Snapdragon 801 device was at 45°C. In the second test, the Snapdragon 810 device was once again cooler, hitting 35°C while the Snapdragon 801 device reached around 43°C.
This test does show that the new generation Qualcomm chip is indeed cooler than the 801 in these specific tests on these particular devices in these ambient temperature situations. Of course, when you take into account other use cases, variations in device designs and variations in ambient temperatures, things could change considerably, so it’s best to take these results with a pinch of salt.
Source • Via